This year’s Biomedical Innovation and Outreach Programme (B.I.O.2022) has come to a great conclusion. The Programme is an initiative by the Department of Mechanical Engineering, HKU, aiming to connect young biomedical researchers to local enterprises, engineers, and mentors via outreach activities.

Koln 3D is happy to be one of B.I.O.2022’s industry partners, hosting a site visit for students in June, while company CEO, Edmond, shared career insights at the Mentor Chat Room session. A big round of applause for everyone committed in building up a supportive mentor-mentee network to foster a sustainable future for the biomedical community!

Event highlights: